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INTEGRATED CIRCUITS
DATA SHEET
PCF84C21A; PCF84C41A; PCF84C81A Telecom microcontrollers
Product specification Supersedes data of 1995 Jul 14 File under Integrated Circuits, IC14 1996 Nov 20
Philips Semiconductors
Product specification
Telecom microcontrollers
CONTENTS 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 14.1 14.2 14.2.1 14.2.2 14.3 14.3.1 14.3.2 14.3.3 15 16 17 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description INSTRUCTION SET HIGH SINK OUTPUT CURRENTS ROM MASK OPTIONS HANDLING LIMITING VALUES DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCF84C21A; PCF84C41A; PCF84C81A
1996 Nov 20
2
Philips Semiconductors
Product specification
Telecom microcontrollers
1 FEATURES 2
PCF84C21A; PCF84C41A; PCF84C81A
GENERAL DESCRIPTION
* Manufactured in silicon gate CMOS process * 8-bit CPU, ROM, RAM, I/O in a 28-lead package * 2 kbyte ROM, 64 byte RAM (PCF84C21A) * 4 kbyte ROM, 128 byte RAM (PCF84C41A) * 8 kbyte ROM, 256 byte RAM (PCF84C81A) * I2C-bus interface with multi-master capability * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 20 quasi-bidirectional I/O Port lines * High sink current capability on the 8 lines of Port 1 * 8-bit programmable timer/event counter 1 * 3 single-level vectored interrupts: - external - 8-bit programmable timer/event counter 1 - I2C-bus * Two test inputs, one of which also serves as the external interrupt input * Stop and Idle modes * Supply voltage: 2.5 to 5.5 V * Clock frequency: 1 to 16 MHz * Operating temperature: -40 to +85 C. 3 ORDERING INFORMATION (see note 1)
This data sheet details the specific properties of the PCF84C21A, PCF84C41A and PCF84C81A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the "PCF84CxxxA family" data sheet which should be read in conjunction with this publication. The PCF84C21A, PCF84C41A and PCF84C81A are general purpose CMOS microcontrollers with 2 kbytes, 4 kbytes and 8 kbytes of program memory and 64,128 and 256 bytes of RAM, respectively. In addition to 20 I/O port lines, the microcontrollers provide an on-chip I2C-bus interface. This two-line serial bus extends the microcontroller capabilities when implemented with the powerful I2C-bus peripherals. These include LCD drivers, I/O expanders, telecom circuits, ADC and DAC converters, clock/calendar circuits, EEPROM and RAM and are listed in "Data Handbook IC12, I2C Peripherals". The instruction set is based on that of the MAB8048 and is a sub-set of that listed in the "PCF84CxxxA family" data sheet.
PACKAGE TYPE NUMBER NAME PCF84C21AP PCF84C41AP PCF84C81AP PCF84C21AT PCF84C41AT PCF84C81AT Note 1. Please refer to the Order Entry Form (OEF) for these devices for the full type number to use when ordering. This type number will also specify the required program and the ROM mask options. SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 DIP28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) VERSION SOT117-1
1996 Nov 20
3
4
P2.0 to P2.2 8 PORT 1 BUFFER PORT 0 BUFFER PORT 0 FLIP-FLOPS PORT 1 FLIP-FLOPS 8
P1.0 to P1.7
P0.0 to P0.7
SCLK
handbook, full pagewidth
1996 Nov 20 BLOCK DIAGRAM
RESIDENT ROM 2 kbytes (PCF84C21A) 4 kbytes (PCF84C41A) 8 kbytes (PCF84C81A) DECODE INTERNAL CLOCK FREQ. 30 MEMORY BANK FLIP-FLOPS 32 T1 8 8 5 8 8 8 TIMER/ EVENT COUNTER PROGRAM STATUS WORD HIGHER PROGRAM COUNTER LOWER PROGRAM COUNTER
SDA/P2.3
3
CLOCK
DATA
PORT 2 BUFFER
Philips Semiconductors
Telecom microcontrollers
PORT 2 FLIP-FLOPS
I2C-BUS INTERFACE
8
4
8
8 8 8 8
8
8 MULTIPLEXER
4
TEMPORARY REGISTER 2 TEMPORARY REGISTER 1 ARITHMETIC LOGIC UNIT INSTRUCTION REGISTER & DECODER T1 DECIMAL ADJUST TIMER FLAG CONDITIONAL BRANCH LOGIC CARRY ACC XTAL 2 INT / T0 INITIALIZE CONTROL & TIMING RESET XTAL 1 OSCILLATOR
INTERRUPT LOGIC
ACCUMULATOR
timer interrupt
SIO/ derivative interrupt
RAM ADDRESS REGISTER
REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 INT / T0 D E C O D E 8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK
external interrupt
DATA STORE
STOP
IDLE
ACC BIT TEST
INTERRUPT
MBB561 - 1
RESIDENT RAM ARRAY 64 bytes (PCF84C21A) 128 bytes (PCF84C41A) 256 bytes (PCF84C81A)
PCF84C21A; PCF84C41A; PCF84C81A
Product specification
Fig.0 Block diagram of PCF84C21A, PCF84C41A and PCF84C81A. Fig.1 Block diagram of PCF84C21A; PCF84C41A and PCF84C81A.
Philips Semiconductors
Product specification
Telecom microcontrollers
5 5.1 PINNING INFORMATION Pinning 5.2
PCF84C21A; PCF84C41A; PCF84C81A
Pin description DIP28 and SO28 packages PIN 1 2 FUNCTION 1 bit of Port 2: 4-bit quasi-bidirectional I/O port bidirectional data line of the I2C-bus interface, or 1 bit of Port 2: 4-bit quasi-bidirectional I/O port bidirectional clock line of the I2C-bus interface 8 bits of Port 0: 8-bit quasi-bidirectional I/O port Interrupt/Test 0 Test 1/count input of 8-bit timer/event counter 1 ground crystal oscillator input or external clock input crystal oscillator output Reset input
Table 1
SYMBOL P2.2
P2.2 SDA/P2.3 SCLK P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 1 2 3 4 5 6 7 8 9 PCF84C21A PCF84C41A PCF84C81A 28 V DD
SDA/P2.3
27 P2.1 26 P2.0 25 P1.7
SCLK
24 P1.6 23 P1.5 22 P1.4 21 P1.3 20 P1.2 19 P1.1 18 P1.0 17 RESET
3
P0.0 to P0.7 4 to 11 INT/T0 T1 12 13 14 15 16 17
P0.6 10 P0.7 11
VSS XTAL1 XTAL2
INT/T0 12 T1 13 VSS 14
MBB562
16 XTAL2 15 XTAL1
RESET
P1.0 to P1.7 18 to 25 8 bits of Port 1: 8-bit quasi-bidirectional I/O port P2.0 to P2.1 26 to 27 2 bits of Port 2: 4-bit quasi-bidirectional I/O port VDD 28 positive supply
Fig.2 Pin configuration.
6
INSTRUCTION SET
7
HIGH SINK OUTPUT CURRENTS
ROM is restricted to 2 kbytes for the PCF84C21A and 4 kbytes for the PCF84C41A. Therefore, the instructions SEL MB1/2/3 for the PCF84C21A, and the instructions SEL MB2/3 for the PCF84C41A should be avoided, as they would define non-existing program memory banks. As RAM is limited to 64 bytes for the PCF84C21A and to 128 bytes for the PCF84C41A, care should be taken to avoid accesses to non-existing RAM locations. See the "PCF84CxxxA family" data sheet for a complete description of the instruction set.
The Port 1 outputs of these devices are designed for high current drive in the logic 0 state. They are capable of driving 10 mA loads and higher. Applications include drive for small relays and light-emitting diodes (LEDs). To avoid overload, care should be taken that the total Port 1 current averages less than 80 mA, i.e. an average of 10 mA per Port 1 line. Refer to Chapter "Limiting values" which specifies an upper limit of 100 mA for ISS.
1996 Nov 20
5
Philips Semiconductors
Product specification
Telecom microcontrollers
8 ROM MASK OPTIONS ROM CODE Program/data
PCF84C21A; PCF84C41A; PCF84C81A
OPTION Any mix of instructions and data up to ROM size of 2 kbytes for the PCF84C21A, 4 kbytes for the PCF84C41A and 8 kbytes for the PCF84C81A.
Port Output P0.0 to P0.7 P1.0 to P1.7 P2.0 to P2.2 SDA/P2.3 Port State after reset P0.0 to P0.7 P1.0 to P1.7 P2.0 to P2.2 SDA/P2.3 Oscillator Transconductance 9 HANDLING LOW (gmL) MEDIUM (gmM) HIGH (gmH) set set set set reset reset reset - - - - - standard standard standard - open-drain open-drain open-drain open-drain push-pull push-pull push-pull -
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See "Data Handbook IC14, Section: Handling MOS devices". 10 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IO Ptot PO IDD ISS Tstg Tj supply voltage all input voltages DC input current DC output current except Port 1 output LOW DC output current, Port 1 output LOW total power dissipation power dissipation per output supply current ground supply current storage temperature range operating junction temperature PARAMETER MIN. -0.5 -0.5 -10 -10 -10 - - -50 -100 -55 - +7 VDD + 0.5 +10 +10 +20 125 30 +50 +50 +150 90 MAX. V V mA mA mA mW mW mA mA C C UNIT
1996 Nov 20
6
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
11 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL VDD IDD PARAMETER operating supply voltage operating supply current see Fig.3 note 1; see Figs 4 and 5 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(idle) supply current (Idle mode) note 1; see Figs 6 and 7 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(stp) Inputs VIL VIH ILI Outputs IOL LOW level output sink current [except Port 1; SDA/P2.3 and SCLK] LOW level output sink current; Port 1 LOW level output sink current; SDA/P2.3 and SCLK HIGH level pull-up output source current HIGH level push-pull output source current VDD = 5 V; VO = 0.4 V; see Fig.9 PCF84C21A; PCF84C41A PCF84C81A VDD = 5 V; VO = 1.2 V; see Fig.10 PCF84C21A; PCF84C41A PCF84C81A IOL2 VDD = 5 V; VO = 0.4 V; see Fig.11 PCF84C21A; PCF84C41A PCF84C81A IOH IOH1 VDD = 5 V; VO = 3.5 V; see Fig.12 VDD = 5 V; VO = 0 V; see Fig.12 VDD = 5 V; VO = 4.6 V; see Fig.13 3 3 40 - -1.6 12 6.5 100 -7 - - - - mA mA A A mA 10 10 30 19 - - mA mA 1.6 1.6 12 5 - - mA mA LOW level input voltage HIGH level input voltage input leakage VSS VI VDD 0 -1 - - 0.3VDD V VDD +1 V A 0.7VDD - supply current (Stop mode) VDD = 2.5 V; notes 1 and 2; see Fig.8 - - - - - 0.2 0.8 1.2 1.7 1.2 0.4 1.6 4.0 5.0 10 mA mA mA mA A - - - - 0.3 1.1 1.7 2.5 0.6 3.0 5.0 6.0 mA mA mA mA CONDITIONS MIN. 2.5 TYP. - MAX. 5.5 UNIT V
IOL1
-140 -400
Oscillator (see Fig.14) gmL gmM gmH RF LOW transconductance MEDIUM transconductance HIGH transconductance feedback resistor VDD = 5 V VDD = 5 V VDD = 5 V 0.2 0.9 3.0 0.3 0.4 1.6 4.5 1.0 1.0 3.2 9.0 3.0 mS mS mS M
Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open. 1996 Nov 20 7
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
MBC953 - 1
handbook, halfpage
18
handbook, halfpage
3
MLA712
f xtal (MHz) 12
I DD (mA) 16 MHz 2
10 MHz guaranteed operating range
6
1 3.58 MHz
0 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection.
Fig.3
Maximum clock frequency as a function of operating supply voltage (VDD).
Fig.4
Typical operating supply current (IDD) as a function of operating supply voltage (VDD).
handbook, halfpage
3
MLA713 - 1
MBB563
handbook, halfpage
1.5
I DD (mA) 2 5V
IDD(idle) (mA) 1.0
16 MHz
10 MHz
1 3V
0.5
3.58 MHz
0 0.1
0 1 10 f xtal (MHz) 100 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection. Supply current based on optimal oscillator selection.
Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal).
Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD).
1996 Nov 20
8
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
MBB564 - 1
MBC954
handbook, halfpage
1.5
handbook, halfpage
3
IDD(idle) (mA) 1.0
5V
IDD(stp) (A) 2
85 C 0.5 3V 1 25 C
o
o
0 0.1
0 1 10 f xtal (MHz) 100 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection.
Fig.8 Fig.7 Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal).
Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD).
MBB565
16 I OL (mA) 12
handbook, halfpage
60
MBB566
I OL1 (mA) 40 PCF84C21A PCF84C41A
8
20
PCF84C81A
4 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
VO = 0.4 V.
VO = 1.2 V.
Fig.9
Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD).
Fig.10 Typical LOW level output sink current for Port 1 (IOL1) as a function of operating supply voltage (VDD).
1996 Nov 20
9
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
handbook, halfpage
16
MBB567
300 I OH (A) 200
MBC960
I OL2 (mA) 12
PCF84C21A PCF84C41A
VO = VSS
8 PCF84C81A
100
VO = 0.7 V DD
4 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
Fig.11 Typical LOW level output sink current for SDA/P2.3 or SCLK (IOL2) as a function of operating supply voltage (VDD).
Fig.12 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD).
handbook, halfpage
12
MBC961
handbook, halfpage
6
MBC962
I OH1 (mA) 8
gm (mS) 4
g mH
4
2
g mM
g mL 0 1 3 5 V DD (V) 7 0 1 3 5 V DD (V) 7
VOL = VDD - 0.4 V.
Fig.13 Typical HIGH level push-pull output source current (IOH1) as a function of operating supply voltage (VDD).
Fig.14 Typical transconductance values (gm) as a function of operating supply voltage (VDD) for the options gmL, gmM and gmH.
1996 Nov 20
10
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
12 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL tr tf fxtal Table 2 PARAMETER rise time all outputs fall time all outputs clock frequency I2C-bus timing (see Figs 15 and 16) PARAMETER INPUT (see Fig.14) OUTPUT (see Fig.15; note 1) CONDITIONS VDD = 5 V; Tamb = 25 C; CL = 50 pF VDD = 5 V; Tamb = 25 C; CL = 50 pF see Fig.3 MIN. - - 1 TYP. 30 30 - MAX. - - 16 UNIT ns ns MHz
SYMBOL SCLK tHD;STA tLOW tHIGH tRC tFC SDA tBUF tSU;DAT tHD;DAT tRD tFD tSU;STO
START condition hold time
14 -------f xtal 17 -------f xtal 17 -------f xtal 1 s 0.3 s
DF + 9 ----------------2 x f xtal DF - 3 ----------------2 x f xtal ; note 2
SCLK LOW time
SCLK HIGH time
DF + 3 ----------------- ; note 2 2 x f xtal 1 s; note 3 0.1 s; note 4 4.7 s; note 5
SCLK rise time SCLK fall time
bus free time
14 -------f xtal 250 ns 0 1 s 0.3 s 14 -------f xtal
data set-up time
15 -------f xtal
; note 6
data hold time
9 -------f xtal 1 s; note 3 0.1 s; note 4 DF - 3 ----------------2 x f xtal
SDA/P2.3 rise time SDA/P2.3 fall time STOP condition set-up time
Notes 1. DF stands for Division Factor: the divisor of fxtal (see the "PCF84CxxxA family" data sheet). 3 ( DF + 1 ) DF - 3 2. Values given for ASC = 0; for ASC = 1: tHIGH = ---------------------------- ; tLOW = ----------------4 x f xtal 4 x f xtal 3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor. 4. At maximum allowed I2C-bus capacitance Cb = 400 pF. 5. Determined by program. t LOW - 9 24 6. If tLOW < -------- , tSU:DAT -------------------- , independent of ASC. f xtal f xtal 1996 Nov 20 11
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
SCLK
0.7 V DD 0.3 VDD t HIGH t LOW
SDA/P2.3
0.7 V DD 0.3 VDD t BUF t HD;STA t RD
t RC
t HD;DAT
t SU;DAT
t FC
t FD
t SU;STO
MBB568
Fig.15 Slave SCLK receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs).
t LOW 0.9 VDD VOLmax t HIGH t FC t FD
SCLK
SDA/P2.3
0.9 V DD acknowledge bit t HD;STA V OLmax
t HD;DAT t SU;DAT
t HD;DAT
t HD;DAT
t SU;STO
MBB569
t SU;DAT
Fig.16 Master SCLK and transmitter SDA/P2,3 timing (SCLK and SDA/P2.3 are outputs).
1996 Nov 20
12
Philips Semiconductors
Product specification
Telecom microcontrollers
13 PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
PCF84C21A; PCF84C41A; PCF84C81A
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1996 Nov 20
13
Philips Semiconductors
Product specification
Telecom microcontrollers
PCF84C21A; PCF84C41A; PCF84C81A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1996 Nov 20
14
Philips Semiconductors
Product specification
Telecom microcontrollers
14 SOLDERING 14.1 Introduction
PCF84C21A; PCF84C41A; PCF84C81A
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 14.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 14.2 14.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 14.3 14.3.1 SO REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Nov 20
15
Philips Semiconductors
Product specification
Telecom microcontrollers
15 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF84C21A; PCF84C41A; PCF84C81A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1996 Nov 20
16
Philips Semiconductors
Product specification
Telecom microcontrollers
NOTES
PCF84C21A; PCF84C41A; PCF84C81A
1996 Nov 20
17
Philips Semiconductors
Product specification
Telecom microcontrollers
NOTES
PCF84C21A; PCF84C41A; PCF84C81A
1996 Nov 20
18
Philips Semiconductors
Product specification
Telecom microcontrollers
NOTES
PCF84C21A; PCF84C41A; PCF84C81A
1996 Nov 20
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
457021/1200/03/pp20
Date of release: 1996 Nov 20
Document order number:
9397 750 01085

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